Which method is used to improve CPU cooling in computers using thermal paste?

The method that improves CPU cooling in computers using thermal paste involves filling microscopic gaps with a compound. Thermal paste, also known as thermal compound or thermal interface material, is applied between the CPU surface and the heatsink. The purpose of this paste is to eliminate air gaps and ensure better thermal conductivity. Air is a poor conductor of heat, so by filling those tiny imperfections and gaps on the surfaces, the thermal paste allows for more efficient heat transfer from the CPU to the heatsink, which helps to keep the CPU cooler during operation.

Using direct contact without any materials would result in poorer heat dissipation due to the presence of air gaps. Thermal pads can provide some level of thermal interface, but they typically do not conform as well to the surfaces as thermal paste does, potentially sacrificing performance. Water cooling systems are a separate cooling method that might be more efficient, but they do not relate directly to the use of thermal paste specifically for improving CPU cooling. Therefore, the optimal approach involving thermal paste maximizes thermal conductivity by ensuring that microscopic gaps are effectively filled.